Meishilong Electronics Clinches 2025 Global Electronic Component Distributor "Annual Growth Star Award" - Dual Consecutive Wins Reinforce Industry Leadership

Global Recognition Validates Company's Commitment to Quality, Innovation and Customer-Centric Solutions

SHENZHEN, China, Dec. 11, 2025 /PRNewswire/ -- Shenzhen Meishilong Electronic Technology Co., Ltd. (MSL MEISHILONG), a leading global distributor of electronic components, has been formally honored with the "2025 Growth Star Distributor Award" at the 2025 International Integrated Circuit Exhibition (2025 IIC). Hosted by AspenCore, a globally renowned authority in the electronics industry, the award marks the second consecutive year that Meishilong Electronics has secured a prestigious accolade from the organization, solidifying its standing as a rapidly growing, trusted leader in the global electronic component distribution landscape.

The "Growth Star Distributor Award" is widely recognized as a benchmark of excellence in the electronics sector, characterized by rigorous evaluation standards and global credibility. Jointly assessed by AspenCore's Senior Editorial Committee and a diverse panel of website user groups spanning Asia, the Americas, and Europe, candidates are evaluated across critical dimensions including market expansion momentum, technical service proficiency, customer loyalty, and innovative contributions to the industry. Recipients are selected through multiple rounds of meticulous screening, ensuring recognition only for enterprises with exceptional performance and significant industry impact. Meishilong Electronics' back-to-back wins serve as a testament to its exceptional growth trajectory and unwavering commitment to excellence, further reinforcing its position as a customer-centric leader trusted by global partners.

Since its establishment in 2009, Meishilong Electronics has maintained a focused expertise in the FPGA technology sector, positioning itself as a trusted partner for global customers seeking solutions to complex FPGA-related challenges. The company specializes in the promotion and distribution of FPGA chips, programmable devices, and passive components, with strategic partnerships with world-class semiconductor brands such as INTEL, ALTERA, ADI, MICRON, and XILINX (AMD). Its product portfolio caters to a wide range of high-growth strategic industries, including telecommunications, data centers, automotive electronics, industrial control, medical electronics, new energy, aerospace, and consumer electronics.

Backed by the 41 years of semiconductor industry expertise and global footprint of its parent company, MSL FPGA INC (MSL MEISHILONG) Electronics has built a robust multi-dimensional operational network covering the United States, Singapore, Hong Kong (China), and mainland China. The U.S. headquarters drives core R&D initiatives, the Singapore team oversees global operational coordination, the Hong Kong transit warehouse ensures a streamlined supply chain, and the Shenzhen branch serves as a key hub for the Chinese market, meeting the diverse needs of customers nationwide. With its core strengths in "original factory-sourced products, stable inventory, technology-driven services, and rapid response," the company has established partnerships with over 30,000 global clients. It further differentiates itself by offering value-added services such as 24/7 operational support and free FAE technical consultation, ensuring timely order fulfillment and efficient resolution of technical issues.

Adhering to the development philosophy of "Quality as the Foundation, Innovation as the Soul," Meishilong Electronics upholds the highest standards of product reliability. All products are RoHS and lead-free certified, with full traceability throughout the supply chain, and visualized production management systems ensure consistent quality control. In terms of technological innovation, the company leverages its parent's portfolio of multiple patents and early experience in the independent R&D of programmable crystal oscillator ICs, continuously refining its product lineup and solutions to address the evolving demands of modern electronic systems for high performance, low power consumption, and compact design. The company also plans to construct a wafer fab in the future to further enhance its integrated capabilities in the semiconductor industry chain, and will continue to focus on the R&D and supply of high-quality and reliable chip products.

A representative of Meishilong Electronics commented: "Winning AspenCore's authoritative award for two consecutive years is not only a powerful validation of our team's relentless efforts and customer-first commitment, but also a resounding recognition of our market-leading strengths in supply chain reliability and technical service excellence. As we look ahead, Meishilong Electronics will continue to leverage our global footprint spanning the U.S., Singapore, Hong Kong and mainland China, deepen strategic alliances with top-tier semiconductor partners worldwide, and further sharpen our competitive edge in agile supply chain management and customized technical support. We remain steadfast in our mission to deliver high-quality, comprehensive electronic component solutions to global customers, empowering enterprises across telecommunications, automotive electronics, new energy and beyond to accelerate their technological innovation journey and gain a decisive edge in the fiercely competitive global marketplace. Together with our partners, we aim to drive the sustainable development of the semiconductor industry ecosystem."

About Meishilong Electronics

Shenzhen Meishilong Electronic Technology Co., Ltd. (MSL MEISHILONG) is a leading global distributor of electronic components, specializing in FPGA chips, programmable devices and passive components. Founded in 2009, the company delivers one-stop, professional solutions to global clients, with a core focus on reliable supply chain services and technical support. Backed by a robust global network spanning the U.S., Singapore, Hong Kong (China) and mainland China, Meishilong Electronics is dedicated to being a trusted partner for enterprises across the global electronics industry.

For more details about Meishilong Electronics' product solutions, global service network and industry achievements, please refer to the official videos released on our YouTube channel:

Contact Us

Shenzhen Meishilong Electronic Technology Co., Ltd. (Mainland China)

1. Address: 2603M Dingcheng International Building, No. 7 Zhonghang Road, Huahang Community, Huaqiangbei Street, Futian District, Shenzhen

2. Official Website: https://www.mslsemi.com/

3. ElectronicBrochure: https://www.mslsemi.com/dianzihuace

4. Email: mslchina@mslsemi.com 

5. Phone: +86 13927453680

6. Additional Website: www.fpgaic.com

7.  Email: meishilong@fpgaic.com 

MSL FPGA INC (USA)

8. Address: 1312 17th Street Unit #2199, Denver, CO 80202

9. Email: mslus@mslsemi.com 

MSL FPGA PTE. LTD. (Singapore)

10. Address: 709 Ang Mo Kio Avenue 8 #01-2591, Singapore 560709

11. Email: mslsingapore@mslsemi.com 

China Meishilong Technology Co., Ltd. (Hong Kong, China)

12. Address: Rm A1-13, Blk A 3/F, Yee Lim Industrial Centre, 2-28 Kwai Lok Street, Kwai Chung, N.T., Hong Kong

13. Email: mslhk@mslsemi.com 

** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **

Meishilong Electronics Clinches 2025 Global Electronic Component Distributor "Annual Growth Star Award" - Dual Consecutive Wins Reinforce Industry Leadership

AI x Fibre: the company will highlight next-generation ultra-low latency optical communication technology, strengthening global AI infrastructure.

BARCELONA, Spain, Feb. 28, 2026 /PRNewswire/ -- Yangtze Optical Fibre and Cable (YOFC) will showcase its latest innovative optical connectivity solutions for the AI era at MWC Barcelona 2026, taking place from March 2 to 5. Under the theme "AI x Fibre – Leading an Intelligent Future," the company will also host a dedicated launch event for its hollow-core fibre (HCF) solutions on March 4 at one of the world's largest and most influential connectivity events.

 

As AI is rapidly reshaping global industries and societal operations, high-speed, low-latency, and highly reliable optical connectivity is becoming essential infrastructure for an intelligent world. As a key transmission technology supporting next-generation AI computing networks, HCF will take centre stage of YOFC's exhibition at booth 5A30.

"Artificial intelligence is profoundly reshaping the global industrial landscape, placing unprecedented demands on ultra‑high‑speed, ultra‑low‑latency optical connectivity. As a premier global platform for mobile communications and digital technology, MWC provides a vital window to showcase cutting‑edge innovations and deepen international collaboration," remarked Zhuang Dan, Executive Director and President of YOFC.

"We believe that advanced optical connectivity not only drives the efficient flow of computing power and data but also contributes to the development of the digital society, connecting us to a more inclusive and sustainable future. YOFC looks forward to working with global industry partners to co‑create a smarter, greener, and more efficient future of optical connectivity."

Centring on "AI X Fibre," YOFC's exhibition at MWC Barcelona 2026 will especially spotlight five key technological highlights, demonstrating how optical fibre technology serves as the core backbone of global AI computing networks:

• AI computing hub: Ultra-high-speed optical fibre interconnection solutions for AI data centres;
• Connecting global AI networks: Supporting backbone network upgrades and cross-border data transmission;
• Empowering AI applications: Covering high-bandwidth scenarios such as high-frequency financial trading, AI data centre interconnection, and quantum communication;
• All-optical connectivity for home and business: Driving all-optical upgrades in residential and enterprise settings.
• VIP showcase: Featuring cutting-edge achievements in optical communication technology.

As a flagship innovation on display, YOFC's HCF represents the forefront of next-generation optical transmission technology. Offering significant advantages over traditional fibre including lower latency, higher transmission efficiency, and enhanced signal quality, it provides critical infrastructure for ultra-high-speed data transmission and AI computing networks. Further details will be unveiled at the launch event during MWC.

As the world accelerates into the AI era, YOFC reinforced its commitment and unveiled the "AI-2030" strategy in 2025, positioning itself as a global leader in AI optical connectivity infrastructure. Built on its three core preform technologies—PCVD, VAD, and OVD—the company has developed a comprehensive "Superior Fibre" portfolio that includes G.654.E fibre, multi-core fibre, and hollow-core fibre (HFC), designed to meet the most demanding transmission needs.

With over a decade of global expansion, YOFC now operates eight production facilities across six countries, serving more than 100 markets worldwide. Through active participation in international standard-setting and cross-industry collaboration, YOFC continues to drive digital and intelligent transformation on a global scale, making high-speed, reliable optical connectivity a driving force behind the advancement of digital society—supporting a smarter, more connected, and more inclusive digital future.

Global industry partners, customers and media are invited to join YOFC at booth 5A30 at MWC Barcelona 2026 from March 2 to 5.

The press conference for HCF launch will take place from 10 a.m. to 12 p.m. on March 4 at T6, Hall 8.0.

For more information, please visit https://en.yofc.com/

** The press release content is from PR Newswire. Bastille Post is not involved in its creation. **

MWC Barcelona 2026: YOFC to Unveil Hollow-Core Fibre (HCF) Solution, Advancing Optical Connectivity in the Era of AI