Eaton announces the expansion of aerospace aftermarket capabilities across Asia-Pacific

• Eaton Aero Services receives Federal Aviation Administration (FAA) Part 145 Repair Station certification
• Eaton expands aerospace engineering capabilities in the region through investments in Singapore supported by the Singapore Economic Development Board (EDB)

SINGAPORE, Sept. 23, 2026 /PRNewswire/ -- Intelligent power management company Eaton announced two strategic expansions at MRO Asia-Pacific 2026, including a new FAA certification for Eaton Aero Services (EAS) — Eaton's joint venture with SIA Engineering Company (SIAEC) — and EDB-supported investments in Singapore to enhance aerospace engineering and innovation expertise.

A major milestone was achieved with the recent FAA Part 145 Repair Station certification obtained by EAS. The certification authorizes EAS to perform FAA-approved maintenance, repair and overhaul (MRO) services and issue FAA airworthiness release certificates. Together with existing approvals from the Civil Aviation Authority of Malaysia (CAAM) and the Civil Aviation Authority of Singapore (CAAS), the certification significantly expands EAS's ability to support regional customers while strengthening its position as a trusted aerospace aftermarket service provider. By expanding certified repair services within the region, EAS reinforces Eaton's localization strategy and its ability to deliver responsive, customer-focused aftermarket support.

Additionally, Eaton is expanding its engineering and innovation capabilities in Singapore with support from EDB, spanning aerospace product innovation, retrofit, modification and upgrade (RMU) programs, engineering solutions and MRO process innovation. Leveraging Singapore's growing aerospace network, talent base and position as a leading aviation hub, these efforts support Eaton's continued expansion in Asia-Pacific while contributing to the development of advanced aerospace talent, high-value engineering jobs and a stronger regional aerospace industry.

"Our continued investment in Singapore, supported by EDB, is strengthening our engineering and MRO capabilities, and enabling us to deliver more responsive and innovative customer solutions across the region," said Ian Lam, managing director, Aerospace Group, Asia-Pacific, Eaton. "Together with EAS's FAA certification, these developments position Eaton to serve customers with greater speed, flexibility and proximity while strengthening our regional aftermarket presence."

Eaton

Eaton is an intelligent power management company dedicated to protecting the environment and improving the quality of life for people everywhere. We make products for the data center, utility, industrial, commercial and institutional, machine building, residential, aerospace and mobility markets. We are guided by our commitment to do business right, to operate sustainably and to help our customers manage power ─ today and well into the future. By capitalizing on the global growth trends of electrification and digitalization, we're helping to solve the world's most urgent power management challenges and building a more sustainable society for people today and generations to come. 

Founded in 1911, Eaton has continuously evolved to meet the changing and expanding needs of our stakeholders. With revenues of $27.4 billion in 2025, the company serves customers in 180 countries. For more information, visit www.eaton.com. Follow us on LinkedIn.

Contact:
Name: Ava Zhang
Phone Number: +86 18917576752
Email address: avazhang@eaton.com

SINGAPORE, Sept. 23, 2026 /PRNewswire/ -- Intelligent power management company Eaton announced two strategic expansions at MRO Asia-Pacific 2026, including a new FAA certification for Eaton Aero Services (EAS) — Eaton's joint venture with SIA Engineering Company (SIAEC) — and EDB-supported investments in Singapore to enhance aerospace engineering and innovation expertise.

A major milestone was achieved with the recent FAA Part 145 Repair Station certification obtained by EAS. The certification authorizes EAS to perform FAA-approved maintenance, repair and overhaul (MRO) services and issue FAA airworthiness release certificates. Together with existing approvals from the Civil Aviation Authority of Malaysia (CAAM) and the Civil Aviation Authority of Singapore (CAAS), the certification significantly expands EAS's ability to support regional customers while strengthening its position as a trusted aerospace aftermarket service provider. By expanding certified repair services within the region, EAS reinforces Eaton's localization strategy and its ability to deliver responsive, customer-focused aftermarket support.

Additionally, Eaton is expanding its engineering and innovation capabilities in Singapore with support from EDB, spanning aerospace product innovation, retrofit, modification and upgrade (RMU) programs, engineering solutions and MRO process innovation. Leveraging Singapore's growing aerospace network, talent base and position as a leading aviation hub, these efforts support Eaton's continued expansion in Asia-Pacific while contributing to the development of advanced aerospace talent, high-value engineering jobs and a stronger regional aerospace industry.

"Our continued investment in Singapore, supported by EDB, is strengthening our engineering and MRO capabilities, and enabling us to deliver more responsive and innovative customer solutions across the region," said Ian Lam, managing director, Aerospace Group, Asia-Pacific, Eaton. "Together with EAS's FAA certification, these developments position Eaton to serve customers with greater speed, flexibility and proximity while strengthening our regional aftermarket presence."

Eaton

Eaton is an intelligent power management company dedicated to protecting the environment and improving the quality of life for people everywhere. We make products for the data center, utility, industrial, commercial and institutional, machine building, residential, aerospace and mobility markets. We are guided by our commitment to do business right, to operate sustainably and to help our customers manage power ─ today and well into the future. By capitalizing on the global growth trends of electrification and digitalization, we're helping to solve the world's most urgent power management challenges and building a more sustainable society for people today and generations to come. 

Founded in 1911, Eaton has continuously evolved to meet the changing and expanding needs of our stakeholders. With revenues of $27.4 billion in 2025, the company serves customers in 180 countries. For more information, visit www.eaton.com. Follow us on LinkedIn.

Contact:
Name: Ava Zhang
Phone Number: +86 18917576752
Email address: avazhang@eaton.com

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Eaton announces the expansion of aerospace aftermarket capabilities across Asia-Pacific

Advancing Next-Generation Grid-to-Chip Energy Architecture for AI Infrastructure

SAN JOSE, Calif., Oct. 15, 2026 /PRNewswire/ -- LITEON Technology (2301) participates in the Open Compute Project (OCP) Global Summit 2026 in San Jose, California, from October 12 to 15, showcasing its next-generation AI factory infrastructure portfolio centered on 800 VDC architecture. The exhibition features power rack solutions supporting the NVIDIA Vera Rubin platform, integrated power and thermal management solutions designed for NVIDIA MGX and OCP ORv3 architectures, demonstrating its Grid-to-Chip technology portfolio.

800 VDC Advances Power and Cooling Architecture for Megawatt-Scale AI Infrastructure

LITEON showcases its 800 VDC Power Shelf integrated with Battery Backup Unit (BBU), demonstrating next-generation 800 VDC power architectures for AI factories. To address the growing thermal demands of high-density AI computing, LITEON debuts the 2.6MW Enterprise Cooling Distribution Unit (CDU) from its strategic investment partner, DCX Liquid Cooling Systems. The solution delivers up to 2.6MW of heat transfer capacity, achieves an approach temperature of 3°C, and incorporates an N+1 redundant pump design to maximize cooling efficiency while ensuring system reliability for high-density AI and HPC deployments. Also on display is the CDU's next-generation HMI and integrated software layer, designed to enhance operational efficiency and provide clear, at-a-glance visibility into key system parameters.

For the NVIDIA Vera Rubin NVL72 platform, LITEON is also showcasing an integrated infrastructure solution featuring a 95kW DC/DC Power Shelf and a 280kW Liquid-to-Liquid (L2L) In-Rack CDU. Designed based on NVIDIA MGX architecture, the solution combines 800 VDC distribution, energy backup, and thermal management technologies to reduce transmission losses and heat generation, improve energy efficiency and power density, simplify power infrastructure, and free additional rack space for high-density AI deployments.

"In the AI era, data center competitiveness is no longer defined solely by compute scale," said John Chang, General Manager of LITEON Cloud Infrastructure Platform and Solution SBG. "Instead, it is measured by tokens per watt and how efficiently power can be converted into meaningful AI output. As AI platforms continue to scale in power density, data centers must simultaneously optimize energy efficiency, cooling performance, and deployment flexibility. High-efficiency power delivery and thermal management architecture have become the critical foundation for scaling future AI Factories."

ORv3 Power and Thermal Management Solutions Support Scalable AI Infrastructure

LITEON is also showcasing an integrated AI power rack solution designed for the ORv3 architecture, integrating an 180kW Power Shelf and a 108kW Capacitor Backup Unit (CBU). Through centralized power delivery and supercapacitor backup capabilities, the solution addresses dynamic AI workloads while enhancing power stability and overall system reliability.

Optimized for liquid cooling compatibility, the ORv3 architecture enables higher-density deployments and greater infrastructure flexibility. LITEON shows key cooling modules including 120kW and 220kW In-Rack CDUs, which can be integrated with advanced cooling technologies such as Direct-to-Chip architectures. These solutions enable greater GPU density, enhanced thermal performance, and flexible infrastructure design for next-generation AI and HPC platforms. By integrating power, backup, and thermal management systems, LITEON helps customers build efficient, reliable, and scalable AI infrastructure.

From 800 VDC Distribution to GPU Power Delivery: Building a Complete Grid-to-Chip Energy Architecture

As AI processors continue to increase in power consumption, efficiently delivering electricity from the rack level to the GPU has become a critical challenge for next-generation AI infrastructure. To address this challenge, LITEON is showcasing its comprehensive DC-DC power conversion portfolio, including 800V Power Bricks, IBC Modules, 50V Power Bricks, and Voltage Regulator Modules (VRM). These product lines bridge every stage of power delivery, from 800 VDC distribution and server-level power conversion to chip-level voltage regulation, demonstrating LITEON's complete Grid-to-Chip energy architecture for future high-density AI computing platforms.

Among these, the 800V DC/DC power brick can be deployed on the HVDC power distribution board (PDB) for downstream distribution and step-down conversion. Multiple bricks can be paralleled to match different power requirements, with active current sharing improving supply stability and reliability. The intermediate bus converter (IBC) then performs the next stage of voltage conversion. This raises overall power delivery efficiency, reduces distribution losses, optimises board area and system cost, and improves supply stability in multi-output architectures. Finally, the voltage regulator module (VRM) delivers a precise, stable operating voltage to the GPU, completing the "last mile" of power delivery from the rack to the chip.

Strengthening the Global Ecosystem to Enable Comprehensive AI Infrastructure Capabilities

As AI computing infrastructure continues evolving toward higher power density and greater energy efficiency, LITEON is expanding its capabilities across power delivery, thermal management, and system-level energy optimization. By extending its expertise from infrastructure power systems to comprehensive Grid-to-Chip energy management, LITEON is building a complete portfolio of AI infrastructure energy solutions.

LITEON continues to deepen collaboration with NVIDIA and the broader OCP ecosystem while leveraging its global manufacturing footprint and localized service capabilities. Through close ecosystem partnerships, LITEON is helping customers address the growing demand for high-performance, highly reliable, and highly scalable infrastructure in the AI Factory era, accelerating deployment and expansion of next-generation AI data centers.

LITEON Technology 2026 OCP Global Summit Exhibition Information:
Date: October 12–15, 2026
Venue: San Jose McEnery Convention Center, USA
Booth: C51, Hall 2

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LITEON Showcases NVIDIA 800 VDC Architecture and Thermal Management Portfolio at OCP Global Summit 2026